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TSMC's 5nm yields reportedly cross 7nm, AMD hinted as a customer for Zen 4's 2021 launch TSMC is the world's leading fabricator of cutting-edge silicon, this fact is undeniable, especially as Intel's 10nm problems persist and Samsung remains unable to generate similar levels of interest in its own 7nm … The technology will be used for risk production of chips starting Q1 2020.TSMC says that it expects N6 to be used for a variety of applications, including mobile SoCs, GPUs, high-performance computing chips, networking, 5G infrastructure, and other products. 22nm to 14nm had a 2.4x density target which as we now know was a very difficult transition.
These findings were further corroborated by Chinatimes as well. The latter will also be offered in a performance-enhanced version called N5P. TSMC will deliver 5nm in 2020 and 3nm (also a FinFET based technology) is scheduled for 2022. The portion in the red box indicates Intel has booked a product at TSMC's 6nm process along with orders on 7nm and 7nm+ from AMD. TSMC’s 5nm EUV Making Progress: PDK, DRM, EDA Tools, 3rd Party IP Ready TSMC: 7nm Now Biggest Share of Revenue TSMC: First 7nm EUV Chips Taped Out, 5nm Risk Production in Q2 2019 The company experienced some delays with Broadwell chips, which were the first to use the 14nm process. Remember, TSMC is on the Apple iProducts schedule so they have to be in HVM early in the year versus late for Apple to deliver systems in Q4. Intel just has to ship chips.The media really latched onto Bob’s comments about destroying the Intel idea of keeping the 90% CPU market share and focusing on growing other market segments. Intel 10nm was officially launched in 2019 and Intel 7nm is scheduled for late 2021 which I have no doubt they will hit given the above targets.I am at IEDM 2019 this week with SemiWiki bloggers Scott Jones and Don Draper (new blogger) so stay tuned. You can expect 5nm+ to fill in the gap year just as 7nm+ did in 2019. Essentially, N6 allows to shrink die sizes of designs developed using N7 design rules by around 15% while using the familiar IP for additional cost savings.TSMC will start risk production of chips using its N6 fabrication technology in the first quarter of 2020. He also said that Intel 5nm will be equivalent to TSMC’s 3nm to which I am not so sure. The 7 nm foundry node is expected to utilize any of or a combination of the following patterning technologies: pitch splitting , self-aligned patterning , and EUV lithography . Those TSMC clients that need a ~ 18~20% higher transistor density are expected to use N7+ and N6 process technologies that use extreme ultraviolet (EUV) lithography for several layers.While both N7 and N6 will be ‘long’ nodes that will be used for years to come, TSMC’s next major node with substantial density, power, and performance improvements is N5 (5 nm). TSMC this week unveiled its new 6 nm (CLN6FF, N6) manufacturing technology, which is set to deliver a considerably higher transistor density when compared to the company's 7 nm (CLN7FF, N7) fabrication process. The company’s N7P and N5P technologies are designed for customers that need to make then 7 nm designs run faster, or consume slightly lower amount of power.TSMC’s N7P uses the same design rules as the company’s N7, but features front-end-of-line (FEOL) and middle-end-of-line (MOL) optimizations that enable to either boost performance by 7% at the same power, or lower power consumption by 10% at the same clocks.
TSMC’s 5nm EUV Making Progress: PDK, DRM, EDA Tools, 3rd Party IP Ready TSMC: 7nm Now Biggest Share of Revenue TSMC: First 7nm EUV Chips Taped Out, 5nm Risk Production in Q2 2019 TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process.